英汉词典

bonders 基本解释

n.压焊机；焊接器；〔建〕束石；丁砖网络本德斯

变形

复数：bonders

bonders 相关例句

词组短语

die bonder芯片焊接机；模片结合器，裸片结合器

wire bonder引线接合器；丝焊器

双语例句

1.havetwoSMTlines,twohand-paste,threeplug-inlines,threehigh-qualitytinafterthebailiffandawirebondersassemblyline.拥有两条SMT线、两条手贴线、三条插件线、三条高质量的执锡后焊线和一条装配线。www.tonke.cn2.Onlyinrarepairbonderslikehumanscanadultmatesusesimilarsubconsciouscuestosustaintheirromancesindefinitely.只有很少的配偶关系如人类，才会在成年伴侣间使用这种相似的潜意识来维持长期的浪漫关系。3.Theyalsoclaimthat"unlikerats,humans are pair bonders"butthisissimplynotthecase.该文作者还声称“与老鼠不同，人类是单配偶的”，但事实绝非如此。4.Portability Plus:Thesmallworldofhotbonders.便携式附件：热耦合器的小世界。www.lib.cafuc.edu.cn5.Nowadays outstanding wire-bondersareallautomaticand they are equippedwellwithmachine-visioneither.目前IC封装业的焊线机已全面自动化，同时也配备了机器视觉系统。www.ceps.com.tw6.Humans, on the other hand,areamongtheraremammals with the capacity to "fallinlove."We're pair bonders.另一方面，人类属于稀有的、有能力恋爱的哺乳动物，我们是需要联姻关系的。7.Industry:Wirebonders;Strippingmachine;Winding machines, stranding machines; Wirestrippingmachine;JumperMachine;TerminalMachine;所属行业：焊线机；剥线机；绕线机、绞线机；导线剥皮机；跳线机；端子机；；www.integrity-enterprises.net8.Industry:Electronicsmanufacturingequipment;SolderingStation;Otherelectricequipment;Wirebonders;Weldingrod;所属行业：电子产品制造设备；焊台；其他电热设备；焊线机；焊条；；www.integrity-enterprises.net9.Industry:Wirebonders;DispensingEquipment;JumperMachine;PressureWelder;Spotwelder;ElectronicsLine;所属行业：焊线机；点胶设备；跳线机；压焊机；点焊机；电子电器生产线；；www.integrity-enterprises.net10.Industry:ResistanceWeldingMachine; Energy storage machine;Spotwelder;Laserweldingmachine;Touchwelder;Wirebonders;所属行业：电阻焊机；储能机；点焊机；激光焊机；碰焊机；焊线机；；www.integrity-enterprises.net

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权威例句

Monitoring ultrasonic wire bonders with a dynamic signal analyzer
Mechanism and control of linear positioning for IC wire bonders
Women’s Voluntary Organizations in Canada: Bridgers, Bonders, or Both?
Holographic Interferometry Applied to Motion Studies of Ultrasonic Bonders
Method of self-correcting bond placement errors of integrated circuit bonders
Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Operating an effective resource allocation for wire bonders in the semiconductor assembly industry
Development of non-destructive bond monitoring techniques for ultrasonic bonders
A microslip model of the bonding process in ultrasonic wire bonders Part I: Transient response
Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging