bumps 基本解释
n.碰撞( bump的名词复数 );肿块;轻微撞车事故;隆起物
v.撞倒,冲撞( bump的第三人称单数 );颠簸着前进;
双语释义
v.(动词)vt. & vi. 撞倒; 冲撞 come against with a blow or knock
vi. 颠簸着前进 move along in an uneven way, like a wheeled vehicle going over bumps
n.(名词)[C]砰的一声;撞击 (the sound of) a sudden forceful blow,like sth heavy hitting a hard surface
[C]肿块 swelling on the body
[C]隆起物 uneven patch on a surface
英英释义
bump
n.a lump on the body caused by a blowsomething that bulges out or is protuberant or projects from its surroundings同义词:bulgehumpgibbositygibbousnessjutprominenceprotuberanceprotrusionextrusionexcrescence
an impact (as from a collision)"the bump threw him off the bicycle"
同义词:blow
v.knock against with force or violence"My car bumped into the tree"
同义词:knock
come upon, as if by accident; meet with同义词:findhappenchanceencounter
dance erotically or dance with the pelvis thrust forward"bump and grind"
assign to a lower position; reduce in rank同义词:demoterelegatebreakkick downstairs
remove or force from a position of dwelling previously occupied同义词:dislodgedisplace
bumps 相关例句
词汇搭配
用作动词 (v.)~+名词- bump the kerb撞到路边石
- bump the tree撞到树上
~+副词- bump along颠簸而行
- bump down颠簸而行
- bump off谋杀
- bump together撞在一起
~+介词- bump against撞着…
- bump into撞着…;偶然碰见
用作名词 (n.)动词+~~+介词- bump between the two cars两车相撞
- bump of locality记不牢地点
词组短语
bump into无意中遇到、碰到
with a bump意外地,突然
bump against撞;碰
bump up突然增加;提升
bump off干掉]
bump mapping凹凸贴图;凸凹处理;凹凸映射
更多收起词组短语
双语例句
用作动词(v.)- I've bumped my knee on the wall.
我的膝盖撞上了墙壁。 - I am so sorry to bump into you.
对不起,我撞到你了。 - The old bus bumped along the mountain road.
旧公共汽车沿著山路颠簸行驶。 - We bumped up and down along the gravel path.
我们沿砾石小路颠簸而行。 - We expect interest rates to be bumped up another quarter point.
我们期望利率再提高0.
用作名词(n.)- She got a bump on her head.
她头上撞起了一个包。 - He fell down with a bump.
他噗通一声倒了下去。
权威例句
Waves, bumps, and patterns in neural field theoriesBars, bumps, and holes: Models for the generation of complex beach topographyIntegrated circuit including conductive bumpsCopper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturingMachine Replacement and the Business Cycle: Lumps and BumpsCoombes, S.: Waves, bumps, and patterns in neural field theories. Biol. Cybern. 93(2), 91-108Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization85. Digital acuity measured by “the bumps” device correlates with degeneration of digital mechanoreceptors in peripheral neuropath...A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsNonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps